This module is engineered for high-fidelity audio amplification, delivering up to 20W of output power. Constructed with surface-mount device (SMD) components on an aluminum printed circuit board (PCB), the module prioritizes thermal efficiency and compact integration. The aluminum PCB facilitates direct mounting to a heatsink, ensuring optimal thermal management.
• TDA7240A Amplifier IC: Providing robust audio amplification with a maximum output of 20W
• Aluminum PCB Substrate: Enhancing thermal conductivity for effective heat dissipation and simplified heatsink
integration.
• Compact Form Factor: Dimensions of 55.5mm × 35.75mm, suitable for space-limited applications.
• Wide DC Power Input: Designed for operation with a DC power supply up to 15V.
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